• Morphological observation

    Morphological observation (1) Observation and measurement of electron microscopic morphology Background introduction The microscopic geometry of the surface of the material largely affe

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  • Tin whisker

    Tin whisker Background introduction Tin whiskers are crystals of a slender shape of tin that grows on the surface of a pure tin or tin alloy coating. In electronic circuits, tin whiskers can

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  • Scanning electron microscopy test (SEM+EDS)

    Scanning electron microscopy test (SEM+EDS) background In recent years, with the increasing complexity of electronic device circuit design and the increasingly strict lead-free solder, the r

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  • Surface analysis

    Surface analysis Surface analysis technology Surface observation is the surface analysis technique that uses electrons, photons, ions, atoms, strong electric fields, thermal energy, etc. to

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  • Ringing wave tolerance test

    Ringing wave tolerance test Overview of Oscillation Wave Immunity This standard mainly introduces the damped oscillatory wave immunity in the national standard GB/T17626.12:1998 (with new ve

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  • Ultrasound scanning (C-SAM)

    Ultrasound scanning (C-SAM) Ultrasonic scanning (C-SAM) introduction C-SAM is an instrument that uses ultrasonic pulses to detect defects such as internal voids in a sample. It is mainly use

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  • Component analysis

    Component analysis Component analysis type Metal analysis, polymer material analysis, inorganic material element analysis, composition or elemental analysis of organic materials E.g:&nb

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  • Red ink test

    Red ink test Red Ink Test - A technique for verifying the surface mount technology (SMT) of electronic parts with or without empty soldering or cracking. This is a groundbreaking experiment that

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