Tin whisker

Tin whisker
Background introduction
Tin whiskers are crystals of a slender shape of tin that grows on the surface of a pure tin or tin alloy coating. In electronic circuits, tin whiskers can cause short circuits, reduce the reliability of electronic devices, and even cause malfunction or failure of electronic devices. Since tin whiskers usually begin to grow several years or even decades after electroplating, they pose a potential hazard to the reliability of the product.
Due to environmental protection and human health considerations, China, Japan, the European Union, the United States and other countries or regions have issued relevant laws or regulations to restrict or prohibit the use of lead in electrical and electronic equipment, so that electronic products are lead-free. The trend of lead-free electronics industry means that the most widely used Sn-Pb solder in the electronics industry will become a history, and the widely used Sn-Pb will also be replaced by new metals or alloys, as a possible substitute, pure Sn, Sn-Bi, Sn-Ag-Cu have been shown to have potential problems with the long-term occurrence of tin whiskers.
Application range
Electronic components, automotive electronics, medical, communications, mobile phones, computers, electrical, etc.
Test procedure
The sample is plated with platinum and placed in a scanning electron microscope sample chamber to magnify and measure the test position requested by the customer.
JESD 22A121.01 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
JESD201A Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
IEC 60068-2-82-2009 Environmental testing - Part 2-82: Whisker test methods for electronic and electric components
Service flow