Scanning electron microscopy test (SEM+EDS)

 

background

 

In recent years, with the increasing complexity of electronic device circuit design and the increasingly strict lead-free solder, the research and application of the chemical nickel-gold process has attracted more and more attention and new developments.

 

As the hub of various components and circuit signal transmission, PCB has become the most important and critical part of electronic information products. Its quality and reliability determine the quality and reliability of the whole equipment. However, due to cost and technical reasons, PCBs have experienced a large number of failures during production and application.

 

For this failure problem, we need to use some common failure analysis techniques to ensure the quality and reliability of the PCB during manufacturing.

 

In the analysis of PCBs, the spectrometer can be used for surface composition analysis, elemental analysis of poor solderability of pads and lead surface surface contaminants. The accuracy of the quantitative analysis of the spectrometer is limited, and the content below 0.1% is generally not easily detected. The combination of energy spectrum and SEM can simultaneously obtain information on surface topography and composition, which is why they are widely used.

 

Application range

 

PCB, PCBA, FPC, etc.

 

Test procedure

 

After the sample was plated with platinum, it was placed in a scanning electron microscope sample chamber, and the test position was magnified by using an acceleration voltage of 15 kV, and the sample was subjected to qualitative semi-quantitative analysis of the sample by an X-ray energy spectrum analyzer.

 

Sample requirements

 

Non-magnetic or weakly magnetic, non-deliquescent and non-volatile solid samples, less than 8CM*8CM*2CM.

 

Recommendation

 

GB/T 17359-2012 Microbeam analysis Energy spectrum quantitative analysis