Slice making

Slice making
(1) Metal/non-metal material section analysis
Observing the internal structure and defect analysis of the sample, analysis of the electroplating process, and the sliced ​​sample can be used to observe the morphology and analysis components, and observe the internal structure by the slicing method, verify the suspected abnormal cracking and voids found in the sample.
Application range
Ceramics, plastics, electroplating products, composite materials, welded parts, metal/non-metal products, auto parts and accessories.
Test procedure
Sampling→cleaning→vacuum inlay→grinding→polishing→microetching (if necessary)→metallographic microscope/SEM observation/component analysis.
IPC-TM 650 2.1.1 and so on.
(2) Electronic component slicing analysis
Technology Introduction
Slice analysis technology is one of the most common and important analytical methods in the PCB industry. It is often used for quality judgment and quality anomaly analysis, to check the quality of circuit boards, to detect PCBA solder quality, to find the cause and solution of failure. And evaluate process improvement as a basis for objective inspection, research and judgment. For the quality of the outer layer or the appearance is poor, it can be judged by optical detector or visual inspection. However, for the quality confirmation of the inner layer or the hole after pressing, it is necessary to conduct quality judgment through slicing and preliminary analysis of the cause of the defect. Slice analysis is an important technique for PCB/PCBA failure analysis. The quality of the slice will directly affect the accuracy of the confirmation of the failure site.
Application field
Electronics industry, metal/plastic/ceramic products industry, auto parts and accessories manufacturing, communication equipment, scientific research institutions, etc.
Service flow