Ultrasound scanning (C-SAM)
Ultrasound scanning (C-SAM)
Ultrasonic scanning (C-SAM) introduction
C-SAM is an instrument that uses ultrasonic pulses to detect defects such as internal voids in a sample. It is mainly used to observe die bond failure, delamination, cracks, inclusions, voids, etc. inside the component. Is a non-destructive test component integrity, internal structure and material internal testing, as a non-destructive testing analysis, it can be achieved without destroying the electrical energy of the material and maintaining structural integrity The material is tested. It is widely used in materials testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA/REL), research and development (R&D) and other fields.
purpose
Non-destructive testing of electronic components, LEDs, metal substrate delamination, cracks and other defects (cracks, delamination, voids, etc.); image contrast is used to determine the difference in internal acoustic impedance of the material, determine the shape and size of the defect, and determine the orientation of the defect.
Application range
Plastic package IC, wafer, PCB, LED
Test procedure
Confirm sample type → select frequency probe → place measurement device → select scan mode → scan image → defect analysis
Scan mode
‧Transmission time measurement mode (A-Scan)
‧Surface and transverse section scanning mode (C-Scan)
‧Longitudinal section imaging mode (B-Scan)
‧Transmission scanning (T-Scan, limited to 15MHz/30MHz probe)
Recommendation
IPC/JEDEC J-STD-035
IPC/JEDEC J-STD-020
MIL-STD 883G, GJB 548B
Service flow
- PreviousBending test
- NextComponent analysis